Associative Processor Thermally Enables 3-D Integration of Processing and Memory

3-D integration of conventional massively parallel processors is challenging due to high temperatures and hotspots. An Associative Processor (AP) is a viable candidate for such applications as it exhibits close to uniform thermal distribution with lower temperatures and fewer hot spots. Performance and thermal analysis supported by simulation confirm that associative processing enables 3-D integration of multilayer processing and memory cubes. Index Terms — 3-D integration, SIMD, Associative Processor, Thermal Analysis ——————————  ——————————